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dc.contributor.authorCunhao Lu
dc.contributor.authorZeyuan Zhang
dc.contributor.authorWei Liu
dc.contributor.authorJian Chen
dc.contributor.otherSchool of Mechanical Engineering Yangzhou University Yangzhou China
dc.contributor.otherSchool of Mechanical Engineering Yangzhou University Yangzhou China
dc.contributor.otherSchool of Mechanical Engineering Yangzhou University Yangzhou China
dc.contributor.otherSchool of Mechanical Engineering Yangzhou University Yangzhou China
dc.date.accessioned2024-01-24T13:38:27Z
dc.date.accessioned2025-10-08T08:52:17Z
dc.date.available2025-10-08T08:52:17Z
dc.date.issued01-01-2024
dc.identifier.urihttp://digilib.fisipol.ugm.ac.id/repo/handle/15717717/37821
dc.description.abstractAbstract The squeeze‐film damping (SQFD) is an important dissipation mechanism of Micro‐Electro‐Mechanical Systems resonators. The current SQFD models of perforated plates treat borders of plate and holes as the constant pressure boundary, without considering border effect. In this paper, the border effect on SQFD is studied by expanding simulation area. At the same time, based on the research of non‐perforated plate border effect, the calculation size of the perforated plate hole cell is modified, and the modified SQFD model of the perforated plate has been built. Compared with simulation results, it shows the border effect has a great influence on SQFD of perforated plate. The precision of the modified model is higher than that of recent models. For a rectangular plate, the maximum error of the modified model is 12%, while for the recent model it is 40%. For a circular plate, the modified model is 38%, while the recent model is 58%.
dc.language.isoEN
dc.publisherWiley
dc.subject.lccChemical technology
dc.titleSqueeze‐film damping model of perforated plate considering border effect
dc.typeArticle
dc.description.keywordsdamping
dc.description.keywordsflow simulation
dc.description.keywordsmicrosensors
dc.description.pagesn/a-n/a
dc.description.doi10.1049/mna2.12185
dc.title.journalMicro & Nano Letters
dc.identifier.e-issn1750-0443
dc.identifier.oaioai:doaj.org/journal:93fa690886f44b44a5fe1d1688f91162
dc.journal.infoVolume 19, Issue 1


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